I have a board with a 208 pin QFP top side. During the wave process the QFP lead at its solder joint reaches 178 degrees C. Eutectic solder reflows at 183 degrees C so the joints should not be reaching molten state and visual observation at least confirms that. What is an acceptable high end temperature for these joints to see before the joint is degraded to the point of being a reliability risk? Are there any empiracle tests that can be used to determine the degradation of the joint if any is taking place? Jim Gryga ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################