I have a board with a 208 pin QFP top side.  During the wave process the
QFP lead at its solder joint reaches 178 degrees C.  Eutectic solder
reflows at 183 degrees C so the joints should not be reaching molten state
and visual observation at least confirms that.  What is an acceptable high
end temperature for these joints to see before the joint is degraded to the
point of being a reliability risk?  Are there any empiracle tests that  can
be used to determine the degradation of the joint if any is taking place?

Jim Gryga

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