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March 1998

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Subject:	Soldermask Adhesion, Bow and Twist
From:	mdsn500 <[log in to unmask]>
Reply To:	DesignerCouncil E-Mail Forum.
Date:	Fri, 20 Mar 1998 13:23:36 -0800
Content-Type:	text/plain
Parts/Attachments:	text/plain (19 lines)

We had some boards in with LARGE areas of tin/lead, unmelted, with
soldermask applied to them. This lot had peeling of the mask from the
unmelted(PrimarySide) as well as secondary side. What are some specific
additives that can be called out to help this problem?
Also, how is Bow and Twist measured? What does the percentage indicate?
Would appreciate any help. Thanks everyone-

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