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March 1998

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Subject:
From:
Steve Schrader <[log in to unmask]>
Reply To:
DesignerCouncil E-Mail Forum.
Date:
Thu, 19 Mar 1998 13:48:00 -0500
Content-Type:
text/plain
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text/plain (78 lines)
Jim,

All defects should be reported.  It is the only way to get an accurate
picture of your process so that you can improve it.  "Touchup" is NOT a
normal, standard part of the process.  A well designed board, run through a
well designed process using solderable components will solder without
defects 100% of the time, it is not black magic.

If you only report yields and defects after all process steps have been
completed, then the goal would be to add as many inspection and test steps
in the process prior to the final test or inspection step so that the
reported defects number "looks" good.  Your focus should be on process
improvement and elimination of non-value added test and inspection steps.
Don't accept "touchup" as the norm or a mandatory process step, get rid of
it.  That should be the goal and it is possible.

You must report all defects and map them back to the process (including
design and materials) that caused them, then solve the problem.

There are always going to be discrepancies in the way defects are reported
from one company to another.  Some might inspect with the naked eye in a
poorly lit room.  Some might inspect with x-ray and 30X scopes.  All other
things being equal, who is going to have a higher yield?

If you report defects only after they have been fixed, you are fooling
yourself...(unfortunately sometimes that is the goal).  You have to decide,
are you trying to deceive or trying to solve the problems?

Steve

Date:         Thu, 19 Mar 1998 13:09:15 EST
Reply-To: "TechNet E-Mail Forum." <[log in to unmask]>,
        RSIMathis <[log in to unmask]>
Sender: TechNet <[log in to unmask]>
From: RSIMathis <[log in to unmask]>
Subject:      [TN] PCB assy defect reporting criteria
X-To:         [log in to unmask]
To: [log in to unmask]

My company is unclear as to how we should be recording and reporting defects
with our PCB assemblies.  Some think that all shorts and opens prior to touch-
up should be reported as defects, others believe we should report only defects
found after touch-up.

Questions:
1.)  How do other companies do this?
2.)  Is there an industry standard method for reporting defects?
3.)  Is there an IPC (or other organization's) standard or manual for
reporting procedures?

Thanks to all,  Jim Mathis

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