DESIGNERCOUNCIL Archives

March 1998

DesignerCouncil@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
DesignerCouncil <[log in to unmask]>
Subject:
Soldermask Adhesion, Bow and Twist
From:
mdsn500 <[log in to unmask]>
Date:
Fri, 20 Mar 1998 13:23:36 -0800
Reply-To:
"DesignerCouncil E-Mail Forum." <[log in to unmask]>, mdsn500 <[log in to unmask]>
Parts/Attachments:
text/plain (19 lines) 
We had some boards in with LARGE areas of tin/lead, unmelted, with
soldermask applied to them. This lot had peeling of the mask from the
unmelted(PrimarySide) as well as secondary side. What are some specific
additives that can be called out to help this problem?
Also, how is Bow and Twist measured? What does the percentage indicate?
Would appreciate any help. Thanks everyone-

################################################################
DesignerCouncil E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE DesignerCouncil <your full name>
To unsubscribe:   SIGNOFF DesignerCouncil 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################

ATOM RSS1 RSS2