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February 1998

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Date:
Mon, 9 Feb 1998 12:54:44 -0800
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From:
Ted Stern <[log in to unmask]>
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Circuit Research
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Dear P.A. Halappa:

LPI developing, by nature of the photopolymer, has the potential to
accumulate more "residue" in the conveyor; subsequently requiring a
higher frequency of equipment cleaning and maintenance.  In feed & bleed
processing, you may have to dump and clean the conveyor approximately
twice as often as you would in dry film developing.

Additionaly, selection of an anit-foam becomes more crucuial.  Petroleum
based anti-foams exhibit a higher affinity for absorption of LPI; and
sometimes form very adherant particulate matter.  Look for an anti-foam
with the highest water solubility/dispersability and use at minimum
concentrations.  It is also recommended the pH probe be selected and
mounted to minimize accumulation of this particulate on the probe; as
well as cleaning and claibrating the probe more frequently.

Please feel free to contact me directly if have additional questions.

Regards,
Ted Stern
612-479-6525

Padmanabha Anandapuram Halappa wrote:
>
>      Hi technetters,
>
>      I am in the progress of implementing Feed & Bleed system
>      for Solder mask developing process, if anyone have any
>      experience implementing such systems please advice.
>
>      thanks......
>

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