Dear P.A. Halappa: LPI developing, by nature of the photopolymer, has the potential to accumulate more "residue" in the conveyor; subsequently requiring a higher frequency of equipment cleaning and maintenance. In feed & bleed processing, you may have to dump and clean the conveyor approximately twice as often as you would in dry film developing. Additionaly, selection of an anit-foam becomes more crucuial. Petroleum based anti-foams exhibit a higher affinity for absorption of LPI; and sometimes form very adherant particulate matter. Look for an anti-foam with the highest water solubility/dispersability and use at minimum concentrations. It is also recommended the pH probe be selected and mounted to minimize accumulation of this particulate on the probe; as well as cleaning and claibrating the probe more frequently. Please feel free to contact me directly if have additional questions. Regards, Ted Stern 612-479-6525 Padmanabha Anandapuram Halappa wrote: > > Hi technetters, > > I am in the progress of implementing Feed & Bleed system > for Solder mask developing process, if anyone have any > experience implementing such systems please advice. > > thanks...... > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################