Make sure that you have no plastic parts. The typical PLCC has a max
temp of 85 degrees C. Check the temp rating of all of your components,
including the connectors. Do not neglect your labeling, etc. Insure that
the silkscren ink used is epoxy base ink per MIL-I-43553. Ditto for
adhesives, thermal pads & grease.
Chris Taylor
Senior Printed Circuit Designer
LXE, Inc.
125 Technology Parkway
Norcross, GA 30092
voice: (770) 447-4224 X3242
fax: (770) 447-6928
e-mail: [log in to unmask]


>----------
>From:  McGlaughlin, Jeffrey A[SMTP:[log in to unmask]]
>Sent:  Monday, February 16, 1998 1:25 PM
>To:    [log in to unmask]
>Subject:       [DC] High Temperature Environment
>
>To All -
>
>I am currently working on the design of a PWB that must continuously
>function (read as IPC-D-275 class 3) at ambient temperatures as high as
>105 degrees C.  I am seeking input as to design criteria for this
>environment.
>
>The items I have already identified include:
>
>200 degree C Tg FR-4/Gtek base material
>Conformal leaded parts where ever available
>No fine line / fine pitch design
>Teardrop at all drilled pads including vias
>
>My primary question is should we be using a "NO LEAD" finish and solder
>for these boards?
>Is there any thing I have overlooked?
>
>TIA
>Jeffrey McGlaughlin
>[log in to unmask]
>Battelle Memorial Institute
>Columbus Ohio
>
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