My company is designing a MCM using chip on board technology. It uses a BT
substrate and a PLCC package with castellations. The substrate is 1 inch
square and gold plated. We have had problems in the past with vendors
successfully manufacturing the substrate with castellations. I have a few
questions:
1) Is this type of package widely used today?
2) Is there a better technology?
3) Recommendations on a vendor that is proven to be able to handle
such a substrate.
4) Are there any reliability issues with this type of package?
5) Has anyone had experience attaching a MCM with castellations to an
OPC type board (Entek PLUS)?
Any comments would be greatly appreciated! Thank you.
Best Regards,
Mike Forrester
LeCroy Corp.
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