My company is designing a MCM using chip on board technology.  It uses a BT
substrate and a PLCC package with castellations.  The substrate is 1 inch
square and gold plated.  We have had problems in the past with vendors
successfully manufacturing the substrate with castellations.  I have a few
questions:
     1) Is this type of package widely used today?
     2) Is there a better technology?
     3) Recommendations on a vendor that is proven to be able to handle
such a substrate.
     4) Are there any reliability issues with this type of package?
     5) Has anyone had experience attaching a MCM with castellations to an
OPC type board (Entek PLUS)?

Any comments would be greatly appreciated!  Thank you.

Best Regards,

Mike Forrester
LeCroy Corp.
[log in to unmask]

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################