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Date: | Mon, 9 Feb 1998 12:54:44 -0800 |
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Dear P.A. Halappa:
LPI developing, by nature of the photopolymer, has the potential to
accumulate more "residue" in the conveyor; subsequently requiring a
higher frequency of equipment cleaning and maintenance. In feed & bleed
processing, you may have to dump and clean the conveyor approximately
twice as often as you would in dry film developing.
Additionaly, selection of an anit-foam becomes more crucuial. Petroleum
based anti-foams exhibit a higher affinity for absorption of LPI; and
sometimes form very adherant particulate matter. Look for an anti-foam
with the highest water solubility/dispersability and use at minimum
concentrations. It is also recommended the pH probe be selected and
mounted to minimize accumulation of this particulate on the probe; as
well as cleaning and claibrating the probe more frequently.
Please feel free to contact me directly if have additional questions.
Regards,
Ted Stern
612-479-6525
Padmanabha Anandapuram Halappa wrote:
>
> Hi technetters,
>
> I am in the progress of implementing Feed & Bleed system
> for Solder mask developing process, if anyone have any
> experience implementing such systems please advice.
>
> thanks......
>
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