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Wed, 4 Feb 1998 10:46:00 -0500 |
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Hello,
As we hear more and more about BGAs, my perception is that there's some
issues to be improved. From a military/high-end commercial application stand
point, I have the following questions:
1- Do people put a lot of vias under BGAs to perform ICT or do they just
perform functional tests ?
2- How do you guys inspect your BGA solder joints once on the card ? Are
X-ray practical and reliable in a production mode ? What about Scanning
Acoustic Microscopy (like a system from Sonoscan) ?
3- And what about repairs ? Are they easily done with a high success rate ?
I'm trying to learn anything I can about BGAs, so any info is welcome, even
the most basic ones.
You can reach me off-line at [log in to unmask]
Thank you.
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