Hello, As we hear more and more about BGAs, my perception is that there's some issues to be improved. From a military/high-end commercial application stand point, I have the following questions: 1- Do people put a lot of vias under BGAs to perform ICT or do they just perform functional tests ? 2- How do you guys inspect your BGA solder joints once on the card ? Are X-ray practical and reliable in a production mode ? What about Scanning Acoustic Microscopy (like a system from Sonoscan) ? 3- And what about repairs ? Are they easily done with a high success rate ? I'm trying to learn anything I can about BGAs, so any info is welcome, even the most basic ones. You can reach me off-line at [log in to unmask] Thank you. ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################