Hi Achim - the current efforts of the EIA/IPC solderability and JEDEC
committees is to have one solderability specification within EIA/IPC/JEDEC
arena - we hope to have completed our efforts by the end of 1998 depending
on how the specification merging progresses. The issue of solderable
finishes other than gold or tin-lead is being addressed by both the
Alternative Solderable finish committee and the Solderability committees -
conditioning, flux choice, etc. There will be an enormous effort in these
areas in 1998. The ANSIJ-STD-002 specification can be used for alternative
finishes right now - silver, bismuth, OSP's, palladium, etc - provided the
user and vendor come to an agreement on which specification test method to
use. The surface mount simulation test method has default requirements for
flux, reflow profiles, etc. but that doesn't preclude a different set of
specifics if an agreement between vendor and user can be reached. Also,
whether a conditioning step (steam aging, dry aging, no aging, etc) is used
is another decision point that can be investigated and agreed upon - there
are defaults but nothing is set in stone. Hope this helps - there is a
large amount of effort being expended to provide information for the
industry specifications but as is typical we seem to be playing catchup.
Contact me directly if I can provide further assistance.

Dave Hillman/Mark Kwoka
ANSIJ-STD-002 Chairmen
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[log in to unmask] on 11/26/97 04:19:41 PM

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To:   [log in to unmask], David D Hillman/CedarRapids/Collins/Rockwell
cc:
Subject:  Re: [TN] Assembly (Solderability)




Hello Dave,
you wrote that the EIA/ IPC committees is working for one document of
solderability
specification. Could you share me what decision is done to cover SnPb
plated and
Pd plated compounends in one specification ?
Thanks in advance for help in this area.
Achim Neu
SIEMENS R&D

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