Hi Achim - the current efforts of the EIA/IPC solderability and JEDEC committees is to have one solderability specification within EIA/IPC/JEDEC arena - we hope to have completed our efforts by the end of 1998 depending on how the specification merging progresses. The issue of solderable finishes other than gold or tin-lead is being addressed by both the Alternative Solderable finish committee and the Solderability committees - conditioning, flux choice, etc. There will be an enormous effort in these areas in 1998. The ANSIJ-STD-002 specification can be used for alternative finishes right now - silver, bismuth, OSP's, palladium, etc - provided the user and vendor come to an agreement on which specification test method to use. The surface mount simulation test method has default requirements for flux, reflow profiles, etc. but that doesn't preclude a different set of specifics if an agreement between vendor and user can be reached. Also, whether a conditioning step (steam aging, dry aging, no aging, etc) is used is another decision point that can be investigated and agreed upon - there are defaults but nothing is set in stone. Hope this helps - there is a large amount of effort being expended to provide information for the industry specifications but as is typical we seem to be playing catchup. Contact me directly if I can provide further assistance. Dave Hillman/Mark Kwoka ANSIJ-STD-002 Chairmen [log in to unmask] [log in to unmask] on 11/26/97 04:19:41 PM Please respond to [log in to unmask]; Please respond to [log in to unmask]; Please respond to [log in to unmask]; Please respond to [log in to unmask]; Please respond to [log in to unmask] To: [log in to unmask], David D Hillman/CedarRapids/Collins/Rockwell cc: Subject: Re: [TN] Assembly (Solderability) Hello Dave, you wrote that the EIA/ IPC committees is working for one document of solderability specification. Could you share me what decision is done to cover SnPb plated and Pd plated compounends in one specification ? Thanks in advance for help in this area. Achim Neu SIEMENS R&D ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################