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December 1997

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Subject:
Crack detection under BGA?
From:
Kevin Jamison <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 31 Dec 1997 12:45:28 -0500
Content-Type:
text/plain
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text/plain (19 lines) 
Dear HELP,

I am seeking any information on equipment with the capability of inspecting / verifying cracks in BGA solder joints.  I currently have X-ray laminography, but this equipment is incapable of crack detection.  

Thank you 
Kevin Jamison  (317) 655-EMPF

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