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December 1997

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TechNet <[log in to unmask]>
Subject:
Crack detection under BGA?
From:
Kevin Jamison <[log in to unmask]>
Date:
Wed, 31 Dec 1997 12:45:28 -0500
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"TechNet Mail Forum." <[log in to unmask]>, Kevin Jamison <[log in to unmask]>
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Dear HELP,

I am seeking any information on equipment with the capability of inspecting / verifying cracks in BGA solder joints.  I currently have X-ray laminography, but this equipment is incapable of crack detection.  

Thank you 
Kevin Jamison  (317) 655-EMPF

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