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December 1997

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Subject:
CuSn Intermetallic growth
From:
Gerard O'Brien <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Mon, 29 Dec 1997 15:11:06 -0500
Content-Type:
text/plain
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I seem to recall that a study was done a while back regarding the rate of growth of Copper tin intermetallics each time a panel was subjected to the HASL process , including reworks.
Any information on said subject?

Regards.

Gerard O'Brien.
Photocircuits Corporation

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