TECHNET Archives

December 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Content-Transfer-Encoding:
quoted-printable
Sender:
TechNet <[log in to unmask]>
Subject:
CuSn Intermetallic growth
From:
Gerard O'Brien <[log in to unmask]>
Date:
Mon, 29 Dec 1997 15:11:06 -0500
Content-Type:
text/plain; charset="us-ascii"
MIME-Version:
1.0
Reply-To:
"TechNet Mail Forum." <[log in to unmask]>, Gerard O'Brien <[log in to unmask]>
Parts/Attachments:
text/plain (20 lines) 
I seem to recall that a study was done a while back regarding the rate of growth of Copper tin intermetallics each time a panel was subjected to the HASL process , including reworks.
Any information on said subject?

Regards.

Gerard O'Brien.
Photocircuits Corporation

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################

ATOM RSS1 RSS2