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December 1997

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Subject:
Re: heeelp - NON-THERMAL RELIEVED VIAS AND COPPER PLANES
From:
"D. Rooke" <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Sun, 21 Dec 1997 21:25:25 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines) 
In addition to Werner's comments, I would suggest that if your fracturing
occurs exclusively on the oxide side of your via to barrel interface, your
oxide process may not be optimum for this type of product design.

Challenge your designer and inquire why no isotherm pattern is used.

Dave Rooke
Viasystems Canada

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