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December 1997

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TechNet <[log in to unmask]>
Subject:
Re: heeelp - NON-THERMAL RELIEVED VIAS AND COPPER PLANES
From:
"D. Rooke" <[log in to unmask]>
Date:
Sun, 21 Dec 1997 21:25:25 -0500
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"TechNet Mail Forum." <[log in to unmask]>, "D. Rooke" <[log in to unmask]>
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In addition to Werner's comments, I would suggest that if your fracturing
occurs exclusively on the oxide side of your via to barrel interface, your
oxide process may not be optimum for this type of product design.

Challenge your designer and inquire why no isotherm pattern is used.

Dave Rooke
Viasystems Canada

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