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Date: | Mon, 1 Dec 1997 09:26:10 -0700 |
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I've been watching the comments regarding TSOP reliability issues for
over a year. I suspect there is some quantitative data available by
now but I need help finding it.
Question #1. How do I reliably determine whether the parts I've
soldered to my boards have Alloy-42 leadframes?
Is the magnet test fool-proof?
Question #2. Some of our boards undergo EXTREME temperature cycling.
Is there any quantitative data available that would
help us predict failure rates of Alloy-42 v/s copper
leadframe TSOPs? Is there any data that shows what
improvement can be gained by underfilling?
Question #3. Any comparisons between Type 1 and Type 2 TSOPs? I
would generally expect Type 1 to be the worst.
Question #4. Any data showing how die size affects the overall
package CTE?
I'd be happy to execute non-disclosure agreements,if necessary,
in order to acquire actual data.
--
Gary D. Peterson
_/_/_/ _/ _/ _/ SANDIA NATIONAL LABORATORIES _/_/_/
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