I've been watching the comments regarding TSOP reliability issues for over a year. I suspect there is some quantitative data available by now but I need help finding it. Question #1. How do I reliably determine whether the parts I've soldered to my boards have Alloy-42 leadframes? Is the magnet test fool-proof? Question #2. Some of our boards undergo EXTREME temperature cycling. Is there any quantitative data available that would help us predict failure rates of Alloy-42 v/s copper leadframe TSOPs? Is there any data that shows what improvement can be gained by underfilling? Question #3. Any comparisons between Type 1 and Type 2 TSOPs? I would generally expect Type 1 to be the worst. Question #4. Any data showing how die size affects the overall package CTE? I'd be happy to execute non-disclosure agreements,if necessary, in order to acquire actual data. -- Gary D. Peterson _/_/_/ _/ _/ _/ SANDIA NATIONAL LABORATORIES _/_/_/ _/ _/_/ _/ _/ P.O. Box 5800, M/S 0503 _/_/ _/_/_/ _/ _/ _/ _/ Albuquerque, NM 87185-0503 _/_/_/_/_/_/ _/ _/ _/_/ _/ Phone: (505)844-6980 _/ _/_/ _/ _/_/_/ _/ _/ _/_/_/_/ FAX: (505)844-2925 _/ _/_/ _/ E-Mail: [log in to unmask] _/_/_/ ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################