From: Apollo De Luna APO7
Subj: Delamination Issues
Are there any direct correlation between the coupling agents being
used in mold compounds to its resistance to delamination ?
How about the amount of release agents on the molding compounds,
does it promote delamination ?
On the type of preconditioning, is there a direct relationship on the
amount and location of delamination on IC packages ?
Are there technical papers discussing about accelerated failures on
IC due to initial delamination ?
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