From: Apollo De Luna APO7 Subj: Delamination Issues Are there any direct correlation between the coupling agents being used in mold compounds to its resistance to delamination ? How about the amount of release agents on the molding compounds, does it promote delamination ? On the type of preconditioning, is there a direct relationship on the amount and location of delamination on IC packages ? Are there technical papers discussing about accelerated failures on IC due to initial delamination ? ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################