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November 1997

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Sender:
TechNet <[log in to unmask]>
X-To:
David D Hillman <[log in to unmask]>
Date:
Wed, 26 Nov 1997 23:19:41 +0100
Reply-To:
[log in to unmask], [log in to unmask], [log in to unmask], [log in to unmask], [log in to unmask]
Subject:
Re: Assembly (Solderability)
From:
Achim Neu <[log in to unmask]>
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Hello Dave,

you wrote that the EIA/ IPC committees is working for one document of
solderability
specification. Could you share me what decision is done to cover SnPb
plated and
Pd plated compounends in one specification ?

Thanks in advance for help in this area.

Achim Neu
SIEMENS R&D

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