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November 1997

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TechNet <[log in to unmask]>
Date:
Tue, 25 Nov 1997 23:34:17 +0100
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[log in to unmask], [log in to unmask], [log in to unmask], [log in to unmask], [log in to unmask]
Subject:
Chip Softpassivation Polyimide
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From:
Achim Neu <[log in to unmask]>
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Hello ALL

I am working on a kind of specification which should desribe the
polyimide surface of chip passivation. The chip will assemble in Flip
Chip and the polyimide must guarantee a good adhesion to epoxy
underfiller.
Any input is welcome to necessary parameters which should be describe
and why.

Regards
Achim

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