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November 1997

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Eddie Brunker <[log in to unmask]>
Date:
Tue, 25 Nov 1997 08:55:34 -0800
Reply-To:
"TechNet Mail Forum." <[log in to unmask]>, Steve Hawn <[log in to unmask]>
Subject:
Re: Via in Pad
From:
Steve Hawn <[log in to unmask]>
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Hi Eddie,

I am interested in the information you mentioned in TechNet.  What
details can you provide?

Steve Hawn
[log in to unmask]

Eddie Brunker wrote:
>
> Charles,
> I have performed trials and produced assemblies with "via in pad" for BGA
> devices. I have X Ray prints and cross sections for this also. I'm sorry
> that I can't give the details over TechNet, but if you (or anybody else
> interested) cares to E mail me then I will return the specifics privately.
>
> Thanks
> Eddie
> [log in to unmask]
>

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