Hi Eddie, I am interested in the information you mentioned in TechNet. What details can you provide? Steve Hawn [log in to unmask] Eddie Brunker wrote: > > Charles, > I have performed trials and produced assemblies with "via in pad" for BGA > devices. I have X Ray prints and cross sections for this also. I'm sorry > that I can't give the details over TechNet, but if you (or anybody else > interested) cares to E mail me then I will return the specifics privately. > > Thanks > Eddie > [log in to unmask] > ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################