We are attempting to attach a nickel-plated copper heatsink to a 10
layer PWB per a set of manufacturing drawings that only states that "the
heatsink shall be attached with prepreg".  It does not call out a
pressure, temperature, cycle time, or a type of prepreg.  We have
assumed that we would need a "low-flow" type of prepreg.  We have tried
some sample cards with a low-flow prepreg (PC-GF 108V by Westinghouse
Fortin) that we have on hand;  we have had good registration of the
heatsink to card, but the adhesion has not been as good as we would have
liked, and the heatsink seems to have been pressed "into" the board (you
can feel the outline of the heatsink on the backside of the card).  We
ran the press at the lowest possible pressure we can for our press (15
lbs).

We are looking for suggestions from anyone who has experience with
laminating heatsinks to PWBs.

Thanks,

Marty W. Sheppard / LYPME
Manufacturing Engineering Support
(912)-926-9632 DSN 468-9632 Fax: (912)926-7974
email:  [log in to unmask]

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