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October 1997

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Subject:
Re: Heatsink lamination
From:
Rodney <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Thu, 16 Oct 1997 14:31:20 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines) 
Marty
I have used this design often, as a designer.  I supply the
manufacturer with art-work that is used to cut the perpreg that goes
between the board and the plate,  allow for flow not to cover
pads.  This saves a lot of manual clean-up. No solder mask under the
prepeg.  I have used up to 0.025" of  prepeg. If you contact me
off-line I can give you more contacts for imformation.
Rodney Brand
205/837-9877x153

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