Hello TechNet Again!
     I have another question.  Is there data concerning soldering iron
     temperatures as related to no-clean/low-residue flux?

     The data I hope to see is on solder iron temperature(s) that is
     preferrable when handsoldering using a no-clean/low-residue flux.

     BACKGROUND:  I have seen differences in flux residues and their affect
     at incircuit test.  I am looking for a relationship of soldering iron
     temperature vs. dwell time vs. flux type.  The flux characteristics
     change.  I have had very good results with the flux in a solder paste
     to the point there is no affect at Incircuit test.  Using that same
     flux type for handsoldering I have seen a residue that is close but is
     more stringy than the residue from the paste.  I am wondering about
     the irom temperature.  Could it be to hot? Is it starting to
     polymerize because of the heat?

     Thanks
     Ron H.

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