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Reply To: | TechNet Mail Forum. |
Date: | Mon, 29 Sep 1997 10:16:23 +0100 |
Content-Type: | multipart/mixed |
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Warren, One way round this I have used is to get one or more
wafers fabricated with a blanket covering of the metal you are
interested in. In my case I had a 4" Si wafer with a layer of
SiO2 followed by Al1%Si for the bonding layer. The supplier then
diced the wafer and put the die into waffle pack. Using blanket
covering means that no expensive masks need to be made and
the entire chip surface is available for wire bond set up. I had
mine done by NMRC in Ireland, but you may be able to get somewhere
a bit more local. From memory the cost was 900 Pound for the diced
wafer. Expensive per chip, but you get a lot of bonding
opertunities per die. The only thing you won't be able to do with
this approach is check bond placement accuracy as there are no pad
surrounds to reference against. I can give you a contact number
for NMRC if you like. They are a university based electronics
research centre in Cork.
hope this helps,
Jeremy Drake
Design to Distribution Ltd
Stoke on Trent
England
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