the entire chip surface is available for wire bond set up. I had mine done by NMRC in Ireland, but you may be able to get somewhere a bit more local. From memory the cost was 900 Pound for the diced wafer. Expensive per chip, but you get a lot of bonding opertunities per die. The only thing you won't be able to do with this approach is check bond placement accuracy as there are no pad surrounds to reference against. I can give you a contact number for NMRC if you like. They are a university based electronics research centre in Cork. hope this helps, Jeremy Drake Design to Distribution Ltd Stoke on Trent England