Subject: | |
From: | |
Reply To: | TechNet Mail Forum. |
Date: | Sat, 27 Sep 1997 13:09:03 -0000 |
Content-Type: | multipart/mixed |
Parts/Attachments: |
|
|
Warren,
you may try wafer fabrication units--Mitel Corporation.Most of fabs have
plenty of rejected wafer . Mitel is in Quebec . I do not have contact
no.
There are no. of fabs in States.Even you may try the manuf of
device/chip --eg. Xylinix, Rockwell,ASM , intel etc.
> ----------
> From: Warren
> Szkolnicki[SMTP:[log in to unmask]]
> Sent: September 26, 1997 12:00 PM
> To: [log in to unmask]
> Subject: [TECHNET] ASSY: Source for "Dummy" Bare Die
>
>
> Does anyone have a source for dummy bare die for use in die bonding /
> wire bonding process setup?
> My preference is for gold metalized die for gold wire bonding.
>
> At this point, I do not need anything as sophisticated as the Sandia
> ATC
> series die.
>
> I have been talking to the people who supply the wire bonding
> equipment,
> but I am also looking for other known sources.
>
> And before anyone says it, Topline does not supply bare die.
>
> Regards
>
> Warren Szkolnicki
> Process Engineer
> Broadband Networks Inc.,
> 37 Stevenson Road,
> Winnipeg, MB, CANADA R3H 0H9
>
> email: [log in to unmask]
> ph: (204) 982-8480 x 229
> fax: (204) 982-8487
> WWW: http://www.broadbandnetworks.com
>
>
|
|
|