Warren, you may try wafer fabrication units--Mitel Corporation.Most of fabs have plenty of rejected wafer . Mitel is in Quebec . I do not have contact no. There are no. of fabs in States.Even you may try the manuf of device/chip --eg. Xylinix, Rockwell,ASM , intel etc. > ---------- > From: Warren > Szkolnicki[SMTP:[log in to unmask]] > Sent: September 26, 1997 12:00 PM > To: [log in to unmask] > Subject: [TECHNET] ASSY: Source for "Dummy" Bare Die > > > Does anyone have a source for dummy bare die for use in die bonding / > wire bonding process setup? > My preference is for gold metalized die for gold wire bonding. > > At this point, I do not need anything as sophisticated as the Sandia > ATC > series die. > > I have been talking to the people who supply the wire bonding > equipment, > but I am also looking for other known sources. > > And before anyone says it, Topline does not supply bare die. > > Regards > > Warren Szkolnicki > Process Engineer > Broadband Networks Inc., > 37 Stevenson Road, > Winnipeg, MB, CANADA R3H 0H9 > > email: [log in to unmask] > ph: (204) 982-8480 x 229 > fax: (204) 982-8487 > WWW: http://www.broadbandnetworks.com > >