Technetters,

        Currently, we are using high temp solder to attach leads on the
component body of a surface mount device.  The customer will use standard
63/37 to attach the other end of the lead to the board.  Historically, we have
used the high temp solder to prevent reflow on the component when the board
goes through the IR oven.  The leads are attached around the edge and pinch
the board.

        Now the question for all the experts.  Does anyone see a problem with
using the same solder for both attachments?  Or, does anyone see a problem
with a second reflow of the solder on the component?

        I hope this makes sense, and thanks for any input.

Glenn Pelkey
Quality/Reliability Engineer
Maxtek Components Corp.