Hello
I would suspect a manfactuer's defect. These parts should
be able to handle the thermals of a through-the-wave process.
It should take the heat from IR as well. However, check your temps.
When I decap is use BOE Glass etchant(a hydrophloric). A very
nasty chemical. If you use it be careful. But it takes off the glass
and preserves the silicon chip. The other best way for F/A would
be a visual examination. Sometimes you can see the die attach.
For visual: lightly sand the glass to get a flat end for viewing.
then examing with your microscope 50 to 100X+ should do
the trick.
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Don F. Fumia
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Schneider Automation
No. Andover MA
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