TECHNET Archives

August 1997

TechNet@IPC.ORG

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Subject:
From:
Frank Hinojos <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 29 Aug 1997 18:22:17 -0700
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     Is there a good design spec that specs the proper relief for pads that
     go through wave solder.  The through-hole pad is surrounded by ground
     plane that can not be covered by soldermask.

     What is a good annular ring space rule for preventing solder bridging?

     Frank


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