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August 1997

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TechNet Mail Forum<[log in to unmask]>
Subject:
Annular ring relief and wave solder
From:
Frank Hinojos <[log in to unmask]>
Date:
Fri, 29 Aug 1997 18:22:17 -0700
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"TechNet Mail Forum." <[log in to unmask]>, Frank Hinojos <[log in to unmask]>
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     Is there a good design spec that specs the proper relief for pads that
     go through wave solder.  The through-hole pad is surrounded by ground
     plane that can not be covered by soldermask.

     What is a good annular ring space rule for preventing solder bridging?

     Frank

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