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Date: | Wed, 16 Jul 1997 09:31:55 -0700 |
Content-Type: | text/plain |
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Joseph Fjelstad wrote:
>
> Hi folks!
>
> Does anyone have a favorite formula for removing the molded plastic from
> around the IC and lead frame for failure analysis?
>
> Thanks in advance to all who reply...
>
> Best to all,
> J. Fjelstad
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Hi,Joseph!
3 decapsulation methods are known to me ,which work well depending
on your appliccation.
1."Automatic" decapsulation ,done with the decapsulators from
B&G Enterprises,Inc.
2880 Research Park Drive,Suite 100
Soquel,CA 95073
408.464.6540
Fax 408.464.6549
They have several models for almost all types of packaging.
I have no experience with their product.
2.Nitric acid , manually.This is ART and needs some experience.
3.Dipping in adequate solvents from
Dynaloy,Inc.
7 Great Meadow Lane
Hanover N.J.07936
(201)887-9270
This is done also manually,and Dynaloy has a booklet on the subject.
Good luck!
GABY
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