 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0woNTP-000BjhC; Wed, 16 Jul 97 01:22 CDT |
| Content-Type: |
text/plain; charset=us-ascii |
| CC: |
|
| Old-Return-Path: |
|
| Date: |
Wed, 16 Jul 1997 09:31:55 -0700 |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| MIME-Version: |
1.0 |
| From [log in to unmask] Mon Jul 21 10: |
21:08 1997 |
| X-Mailing-List: |
|
| TO: |
|
| X-Status: |
|
| Return-Path: |
<TechNet-request> |
| Status: |
O |
| X-Loop: |
|
| References: |
|
| Content-Transfer-Encoding: |
7bit |
| Resent-Message-ID: |
<"6felM1.0.6T9.BY6pp"@ipc> |
| Subject: |
|
| From: |
|
| X-Mailer: |
Mozilla 2.02 (Win16; I) |
| >From willli Wed Jul 16 01: |
22:17 1997 |
| Organization: |
Tadiran Telecommunactions Ltd. |
| Message-ID: |
|
| Parts/Attachments: |
|
|
Joseph Fjelstad wrote:
>
> Hi folks!
>
> Does anyone have a favorite formula for removing the molded plastic from
> around the IC and lead frame for failure analysis?
>
> Thanks in advance to all who reply...
>
> Best to all,
> J. Fjelstad
> *************************************************************************
> _/_/_/_/ /__ __/ / ____/ / ___/ / ___/ / ___/ / __ / / \
> _/_/_/_/ / / / /___ /___ / / __ / / _ \
> _/_/_/_/ / / / __/ / / / / __/ / / \ \ / ___ \
> _/_/_/_/ /_/ /_____/ /____/ /____/ /_____/ /_/ \_\ /_/ \_\
>
> ...System Building Blocks for the Next Generation of Electronics
>
> 3099 Orchard Drive
> San Jose, CA 95134
> Phone 408 894-0700
> Fax 408 894-0768
>
> ***************************************************************************
> * TechNet mail list is provided as a service by IPC using SmartList v3.05 *
> ***************************************************************************
> * To subscribe/unsubscribe send a message <to: [log in to unmask]> *
> * with <subject: subscribe/unsubscribe> and no text in the body. *
> ***************************************************************************
> * If you are having a problem with the IPC TechNet forum please contact *
> * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
> ***************************************************************************
Hi,Joseph!
3 decapsulation methods are known to me ,which work well depending
on your appliccation.
1."Automatic" decapsulation ,done with the decapsulators from
B&G Enterprises,Inc.
2880 Research Park Drive,Suite 100
Soquel,CA 95073
408.464.6540
Fax 408.464.6549
They have several models for almost all types of packaging.
I have no experience with their product.
2.Nitric acid , manually.This is ART and needs some experience.
3.Dipping in adequate solvents from
Dynaloy,Inc.
7 Great Meadow Lane
Hanover N.J.07936
(201)887-9270
This is done also manually,and Dynaloy has a booklet on the subject.
Good luck!
GABY
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
* with <subject: subscribe/unsubscribe> and no text in the body. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
|
|
|
