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July 1997

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Subject:
Mechanism of Wedge Void Formation
From:
[log in to unmask] (Josep Sajut)
Date:
Mon, 14 Jul 1997 18:06:52 -0400
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What is the mechanism of wedge void formation and how is it to be
stopped?

We use electroless copper.  I heard there was less frequency with direct
metallization.  Does anyone know?

Are there multiple causes and mechanisms?

What are the frequencies of appearance?

Does anyone know quantifiable kinetics of acid copper plating on
different surfaces?

[log in to unmask]

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