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July 1997

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Subject:
Re: Mechanism of Wedge Void Formation
From:
"tgyee" <[log in to unmask]>
Date:
Tue, 15 Jul 97 09:48:51 PST
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     Wedge voids can be caused by surfactant sipping into interlayer gap 
     when the interlayer adhesion is poor. Associated with wedge voids are 
     usually pink rings. Can somebody tell me if DM can help preventing 
     wedge void (and also pink ring), and if so, why?


______________________________ Reply Separator _________________________________
Subject: Mechanism of Wedge Void Formation
Author:  [log in to unmask] at corp
Date:    7/14/97 3:56 PM


What is the mechanism of wedge void formation and how is it to be 
stopped?
     
We use electroless copper.  I heard there was less frequency with direct 
metallization.  Does anyone know?
     
Are there multiple causes and mechanisms?
     
What are the frequencies of appearance?
     
Does anyone know quantifiable kinetics of acid copper plating on 
different surfaces?
     
[log in to unmask]
     
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