TECHNET Archives

July 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Reply to "what is via tenting?"
From:
"Dejan" <[log in to unmask]>
Date:
Wed, 16 Jul 1997 17:00:37 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (19 lines) 
1. Via tenting is used to describe the application of Dry Film Solder 
Mask to prtect the via holes.

2. For LPI application the term that is appropriate is via capping or 
via hole covering. 

3. For further information, see IPC-SM-840C; pages 6 and 14.

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************

ATOM RSS1 RSS2