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July 1997

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>From willli Wed Jul 16 18:
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1. Via tenting is used to describe the application of Dry Film Solder 
Mask to prtect the via holes.

2. For LPI application the term that is appropriate is via capping or 
via hole covering. 

3. For further information, see IPC-SM-840C; pages 6 and 14.

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