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Subject:	Re: Solder compatibility
From:	[log in to unmask]
Date:	Fri, 11 Jul 1997 08:59:25 -0400 (EDT)
Content-Type:	text/plain
Parts/Attachments:	text/plain (26 lines)

Dave,

in your reply you recommend the use of Scanning Electron Microscopy analysis
techniques. As far as I know there are some methods available - single point,
areal
and others, depending on the required analysis resolution. Talking about a
final
composition of Sn/Pb/Ag (even some small zones only) what analysis technique
would be recommendable ? Furthermore, any recommendations for Solder Joint
Reliability Testing?

Regards,

Christian 

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