Dave, in your reply you recommend the use of Scanning Electron Microscopy analysis techniques. As far as I know there are some methods available - single point, areal and others, depending on the required analysis resolution. Talking about a final composition of Sn/Pb/Ag (even some small zones only) what analysis technique would be recommendable ? Furthermore, any recommendations for Solder Joint Reliability Testing? Regards, Christian *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************