Hi TechNet;

We are working to establish company specifications around  Immersion Au as a
solderable surface.  I'd like to collect general positions most folks have on a
few items;

where are you leaning in terms of specifying the following;

Storage Requirements
bags?
sealed bags?
use of desiccants?
other?
Solderability
Rotary Dip
paste and reflow
other?
Aging:
To simulate a part aged for x amount of time, we typically use an accelerated
test.
What life are you aiming for?  90 days, 6 mos?  1 year?
what accelerated test are you leaning towards?

My thanks in advance to all respondents!  Let me know if you'd like the results
published back to you.



Jim Herard
KBL, Product Quality Engineering
IBM Microelectronics Endicott
t/l 857-7026

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