Hi TechNet; We are working to establish company specifications around Immersion Au as a solderable surface. I'd like to collect general positions most folks have on a few items; where are you leaning in terms of specifying the following; Storage Requirements bags? sealed bags? use of desiccants? other? Solderability Rotary Dip paste and reflow other? Aging: To simulate a part aged for x amount of time, we typically use an accelerated test. What life are you aiming for? 90 days, 6 mos? 1 year? what accelerated test are you leaning towards? My thanks in advance to all respondents! Let me know if you'd like the results published back to you. Jim Herard KBL, Product Quality Engineering IBM Microelectronics Endicott t/l 857-7026 *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************