Hi,

Does anyone know how would the grain size of the matt surface of the Cu
foil (say 1/2 oz)
affect the etching performance, peel strength and any other properties of
the PCB?

The reason is we have a Cu foil supplied from Japan with very fine grain
nodules < 1um.
Then another from Korea with larger grain at the matte surface (1 - 2um)
under the SEM.

Smooth side for this Korean foil is also rougher.

I read one article from the Japan supplier that the smaller the grain the
faster the etching rate, thus easier and better etching especially for
fine-lines.
Any Comment?

Richard


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